Intel Corp (NASDAQ:INTC) has been on the path to deliver innovations that ensure it is competitive in various ways beyond process technology. Among the ways, the company is accomplishing through packaging technologies like the Foveros tech.
Intel creating new processors using Intel Hybrid technology
The Foveros technology allows the company to create modular chip designs that help designers change chip dies as per the application. This implies that they will be able to combine GPU cores, CPU cores, memory, and accelerators from various process nodes. As a result, this allows Intel to develop the chip dies according to optimal process node for performance, yields, and cost.
Early this year, Intel Lakefield was teased at CES, and Intel Hybrid Technology is calling it Intel Core, and it is the company’s first product using this technology. The company designed the Core processors using the Intel Hybrid Technology to permit new processor sizes and designs that were not possible before. The new processor is an incredibly small chip of 12mmx12mm, which means that they can fit in small devices like 8-inch tablets, laptops, or foldable. Intel achieves this through the stacking of different dies on each other.
Acer is using Intel’s Xe graphics in its latest Swift 5 laptop
Acer is launching its new Swift 5 laptop, which will be the first laptop to be powered by Intel’s 11 generation processors. The processors feature the integrated Xe graphics that Intel promised at CES 2020. The Xe graphics will provide enhanced graphics performance relative to the 11th generation graphics. The shift from the Gen11 graphics to Xe will be a big move for Acer, although the company has not offered much detail.
The Xe architecture will power Intel’s anticipated secrete GPUs, and for those that love more power, the Swift 5 laptop will provide an alternative discrete Nvidia GeForce MX350 GPU. Besides the new processors, Acer also reducing the bezels to offer a 90% screen to body ratio. However, the panel is still offering a 14″ FHD display.
